Benefits of the Hypertac technology include low contact forces and resistance, protection against shock and vibration, exceptionally high mating cycles, high signal integrity, and a self-cleaning wiping action. Hypertac connectors can be found in many of the company’s specialty technologies, including the ClearImage line of nonmagnetic interconnects for applications such as coils, hospital beds, and imaging systems. Features include contact life cycles of up to 25,000 cycles and a temperature rating of -55º C to 125º C.

The Hypertac series of connectors from Hypertronics, Hudson, MA, have an unusual design that supports performance requirements previously considered nearly impossible, according to the company. The shape of the contact sleeve is formed by wires strung at an angle to the socket's axis to align elastically around the pin, providing multiple linear contact paths. The company refers to this configuration as a “hyperboloid basket” design. When the pin is inserted into this sleeve, the wires stretch around it, providing 360° of contact points.

Also, the ImplanTac connectors are made of bio-compatible material for use in implantable medical devices that require high reliability and dependability such as pacemakers, cardioverter-defibrillators, neurostimulators, metabolic controls, and bone-growth stimulators. Standard and customizable versions are available.

ImplanTac bio-compatible contacts let surgeon easily mate implanted leads into devices without misalignment, damage to the system, or risk to the patient.

The contacts (coax, pins and sockets) of ClearImage interconnects are made from non-magnetic brass, beryllium copper, and phosphor bronze, with plating being gold over copper flash over base metal.

In addition, the HyperSpring contacts combine hyperboloid technology with the mechanical features of a spring-loaded contact to provide a reliable connection. Conduction is handled by the hyperboloid socket placed between the barrel and the plunger of a common spring-loaded contact. Hence, the material used to form the spring may be selected solely on the basis of its mechanical properties, primarily its elasticity. This helps in optimizing the physical performance of the overall system. The contacts feature improved signal integrity, high reliability and current density, and parametric stability over time. They are suitable for low-height printed circuit board interconnect and high-density applications. They also work well as a connection test system for microchip wafer testing.

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