Designers intro to advanced medical adhesives
Advanced adhesives can improve the design of joints and the assembly of disposable and reusable medical devices.
Temperatures
Adhesives for bonding components of medical devices cover a wide range of temperature services from cryogenic to over 660F for brief periods, such as, when wave soldering or brazing. Cure schedules depend on the adhesive formulation, the substrate temperature characteristics, time of exposure, amount of compound used, and environmental conditions. Preferred high-performance-type structural adhesives can be cured from ambient to as high as 400 to 500F. The preferred range is about 250 to 357F. Here are a few pertinent temperatures and characteristics for a widely used range of adhesives.
-
Epoxy structural adhesives are recognized for providing the highest physical-strength properties and outstanding versatility in widely different applications from cryogenic to +500F service.
-
Polyamides and so-called liquid-crystal polymers may be considered specialties particularly for high-temperature service.
-
Polyurethanes are tough and flexible but are generally limited to 212 to 257F service.
-
Silicones feature unmatched flexibility and color stability in service to 500F, but are considered to have limited strength, little abrasion resistance at elevated temperatures.
-
Cyanoacrylates offer unmatched cure speed and high strength for many substrates, but lack toughness and flexibility. Usage is limited to 212F.
-
Thermoplastic adhesives are presently limited to joining plastics to each other, or to metals and ceramics. Many exhibit limited service performance.
-
Fluoropolymers offer the best chemical-resistance properties but exhibit relatively low adhesive strength with service capabilities to 500F.
-
UV and light-curing adhesives are currently limited to applications in which such light contacts the initially liquid composition. Then it cures in a few seconds. A fast cure enhances productivity.
Surface prep
It's not surprising that the best adhesion or bond requires properly prepared, cleaned, and roughened substrates. Physical abrasive treatments and appropriate chemical cleaning, or both, are essential manufacturing steps for achieving desired performance characteristics with most metallic substrates. Specially formulated primer coats are also useful in some applications. Be aware, however, that mold releases and surface treatments all adversely affect adhesive performance and are considered contaminants. A great deal of R&D has been carried out to develop suitable pretreatments for metallic as well as nonmetallic substrates. An accompanying table details a few recommended pretreatments.
Sterilization
Biocompatibility and sterilization are among the most important factors for bonding medical components to assure the safety of patients and hospital personnel. Medical devices conveniently divided into disposable and reusable products. Most disposable plastic materials for medical devices are thermoplastics such as polyethylene, polypropylene, ABS, and polyvinylchloride. Reusable devices from plastics are possible thanks to particular thermosetting epoxy compounds.
Test and performance criteria include USP VI and more importantly ISO VI protocols as well as ISO10993. These and other regulations describe systemic and intracutanacious in vivo and in vitro testing, in vivo implant tests, and certain animal tests.
But passing these tests is not sufficient for obtaining FDA approval. The agency's requirements depend on specific applications and may well require additional testing. Conformance to the USP VI test protocol and biocompatibility tests are a good indication of the suitability and toxicological safety of a proposed adhesive component for a medical device. Depending on the medical device, sterilization may be required before and after applying the adhesive.
| Thermoplastics | Thermosetting Plastics | Metals | Ceramics | Semiconductors |
|---|---|---|---|---|
| Polystyrene | Epoxies | Aluminum | Aluminum oxide | Silicon |
| ABS | Thermoset polyesters | Copper | Magnesium oxide | Germanium |
| ABS | Phenolics | Stainless steel | Silica | Aluminum gallium arsenide |
| Polycarbonates | Polyimides | Titanium | Quartz | gallium arsenide |
| Polyethylene, polypropylene and copolymers | Polyurethanes | Nickel | Aluminum oxide | Silicon carbide |
| Polyamides (Nylons) | Silicones | Cobalt | Magnesium salts | III-V semiconductors e.g. aluminum, gallium arsenide phosphate |
| Polyacetols | Cyanoacrylates | Silver | Titanium oxide | diamond |
| Polyvinylchloride and copolymers | Polysulfide | Gold | Graphite | Tin sulfide |
| Polyesters (PET, PBT, etc.) | UV and Light curing compounds | Platinum | Boron nitride | Lead telluride |
| Polyurethanes |
| Tungsten | Zirconium silicate | Zinc oxide |
| Polysulfones | Vapor phase applied polymers | Boron | Aluminum oxide | Cuprous chloride |
| Polyether ether ketones | Epoxies | Magnesium | Barium sulfate |
|
| Fluoropolymers |
| Lithium | talc |
|
| Liquid | Viscosity |
|---|---|
| Water | 1.0 |
| Milk | 6.0 |
| Ethylene glycol (antifreeze) | 15 |
| SAE 30 motor oil | 150 to 200 |
| Castor oil | 1000 |
| Maple syrup | 4000 |
| Honey | 10,000 |
| Chocolate syrup | 25,000 |
| Ketchup | 50,000 |
| Mustard | 50,000 to 60,000 |
| Sour cream | 100,000 |
| Peanut butter | 250,000 |
| Shortening | 360,000 |
| Substrate | Recommended pretreatments |
|---|---|
| Aluminum and its alloys | Solvent degreasing, detergent scrubbing, acid etching, sulfuric acid, sodium dichromate immersion, water rinse, physical abrasion. |
| Beryllium or Beryllium-copper | Solvent degrease, detergent scrubbing, physical abrasion, sodium hydroxide, hydroxide/water solution at 80°C, water rinsing and dry. |
| Chromium | Solvent degreasing, physical abrasion, nickel electroplating or hydrochloric acid etching; water rinsing, dry. |
| Copper and its alloys | Solvent degreasing, physical abrasion, fast concentrated hydrochloric acid etch, acid etching (nitric acid or ammonium persulfate solution), rinse and dry. |
| Magnesium and alloys | Solvent cleaning, dry abrasion, acid etching, rinse and dry. |
| Nickel and its alloys | Vapor degreasing, acid etching, water rinsing, drying. |
| Stainless steel | Solvent degreasing, detergent scrubbing, acid etching (sulfuric acid or chromic acid). Water rinsing, drying. |
| Silicon semiconductors | Solvent cleaning or abrasion. |
| Titanium | Solvent degreasing, physical abrasion, acid etching, strong mensoral acids, neutralizing rinse, air drying. |
| Zinc | Solvent degreasing, dry or wet abrasion, water rinsing, drying. |
| Acrylic plastics | Solvent cleaning, abrasion, acid etching epoxy/solvent adhesives, UV/light curing adhesives. |
| ABS plastics | Solvent cleaning, abrasion, selective etching, rinsing, drying. |
| Acetal resins and copolymers | Solvent cleaning, wiping, abrasion, acid etching, rinse and dry. |
| Celluloric homo and coploymers | Solvent treatment, abrasion, solvent bonding, heating, |
| Diallylphthalates | Solvent cleaning, abrasion, bonding with thermoset polymers such as epoxies |
| Epoxy resins and epoxy phenolics | Solvent treatment, abrasion, epoxy resin adhesives. |
| Polyamides (nylons) | Solvent abrasion treatments, polyurethanes and polyamide resins, cyanoacrylates |
| Polyesters, thermoplastics (PET, PBT) | Solvent treatments, abrasion, primers, caustic solutions, UV or light curing adhesives |
| Polycarbonates | Solvent cleaning abrasion, acrylic or epoxy adhesives, UV/light curing adhesives. |
| Polysulfones and Polyether elastomers | Solvent cleaning, abrasion, epoxy or epoxy phenic adhesives. |
| Polyolefins (Polyethylene, Polypropylene) | Solvent cleaning, abrasion, oxidizing flame treatment, acid etching. |
| Thermo plastic elastomers such as EPDM | Corona discharge, plasma treatment, hot melts, primers. |
| Ceramics | Solvent cleaning, abrasion, epoxy or epoxy phenic bonding |
| Carbon and carbon fibers | Solvent cleaning, abrasion. |
| Fluoropolymers (e.g. Teflon, Viton) | Solvent cleaning, followed by specialty primer, epoxy type adhesives. |
| Silicones | Solvent cleaning, specialty primers, silicone adhesives. |
| Sterilization | How it's done | Example adhesives |
|---|---|---|
| High energy radiation | Isotopes, electron beam accelerators, x-rays | EP62-1MED, EP30MED |
| Autoclaving | Steam usually 6 to 12 min at 130 to 140C, and a specified number of times. | EP42HT-2, EP3HTMED |
| Ethylene oxide | Exposure at ambient or near ambient temperatures for specified times, such as, over 10 hrs. | EP21LV, EP41SMED |
| Liquid sterilants | Glutaraldehyde | EP41SMED, EP21LV |
| Plasma | Hydrogen peroxide solutions | EP42HT-2, EP30MED |
| Corona discharge |
| All medically approved adhesives |
| Peroxide acid solutions |
| All medically approved compounds |
The transparent MB297 cyanoacrylate adhesive has a refractive index of 1.48, a Shore A hardness of 85, and excellent resistance to most environmental conditions such as moderate heat, aging, and many chemicals. It has a volume resistivity of 8.6 x1012 ohm-cm and a dielectric constant of 3.5 at 1,000Hz.
A closer look at a recent medical adhesive
Developments in medical adhesives are coming at a steady pace. A recent introduction, for example, includes an ultra-fast, room-temperature curing ethyl cyanoacrylate that bonds well to glass, ceramics, metals, rubbers and most plastics. MB297 Medical is a high strength bonding compound in a one-component system. UV-curable cyanoacrylates are also available.
Many medical-grade adhesives features a low viscosity of 2,000 to 2,400 cP making it easy to apply. Bond periods generally range from a few seconds to less than 60 depending on atmospheric humidity and the substrates being bonded. Some compounds need only contact pressure after applying them.
Want to use this article? Click here for options!
© 2012 Penton Media Inc.
Acceptable Use Policy blog comments powered by Disqus
Webcasts
- How to Quantifiably Confirm Cure of Light Cure Adhesives
Sponsored by: Henkel - View Webcast Archive
advertisement













