Master Bond EP11SIC is a silver-filled epoxy-resin system with high electrical and thermal conductivity. It has the convenience of a one-component system in addition to flexible cure schedules. It adheres well to metallic and nonmetallic substrates with tensile strength greater than 6,000 psi and tensile-shear strength over 1,500 psi. EP11SIC is tough for a filled system and features good resistance to thermal shock, high temperatures, and chemicals. It is recommended for bonding, potting, sealing and coating between -60 to 300F. Gel time at 300F is about 20 to 25 min and 40 to 50 min at 347F.  Typical performance properties include a low volume resistivity of less than 0.001 ohm-cm, a surface resistance of less than 1 ohms/square, and a thermal conductivity of 7.9 W/meter-K (55 BTU/in/hr/ft2/F).
Master Bond, 154 Hobart St., Hackensack, NJ 07601, (201) 343-8983,
info.ims.ca/18359-255